Magnetic tunnel junction memory devices employing resonant tunneling and methods of manufacturing the same

ABSTRACT

A magnetoresistive memory device includes a magnetic tunnel junction including a free layer, at least two tunneling dielectric barrier layers, and at least one metallic quantum well layer. The quantum well layer leads to the resonant electron tunneling through the magnetic tunnel junction in such a way that it strongly enhances the tunneling probability for one of the magnetization states of the free layer, while this tunneling probability remains much smaller in the opposite magnetization state of the free layer. The device can be configured in a spin transfer torque device configuration, a voltage-controlled magnetic anisotropy, a voltage controlled exchange coupling device configuration, or a spin-orbit-torque device configuration.

FIELD

The present disclosure relates generally to the field of magnetic (e.g.,spintronic) memory devices, and specifically to magnetic tunnel junctionmemory devices employing resonant electron tunneling, methods ofoperating the same, and methods of manufacturing the same.

BACKGROUND

A magnetoresistive memory device can store information employing thedifference in electrical resistance of a first configuration in which aferromagnetic free layer has a magnetization direction that is parallelto the magnetization of a ferromagnetic reference layer and a secondconfiguration in which the free layer has a magnetization direction thatis antiparallel to the magnetization of the reference layer. Programmingof the magnetoresistive memory device requires flipping of the directionof the magnetization of the free layer employing various external powersources, which may be magnetic in nature or may employ a spin transfermechanism.

SUMMARY

According to one embodiment of the present disclosure, amagnetoresistive memory device comprises a first electrode, a secondelectrode, and a magnetic tunnel junction located between the firstelectrode and the second electrode. The magnetic tunnel junctioncomprises a ferromagnetic reference layer, a ferromagnetic free layer, afirst tunneling dielectric layer located between one of the referencelayer or the free layer, and one of the first electrode of the secondelectrode, and a second tunneling dielectric layer located between thereference layer and the free layer. At least one of the reference layeror the free layer comprises a quantum well.

According to one embodiment of the present disclosure, amagnetoresistive memory device comprises a first electrode, a secondelectrode, and a magnetic tunnel junction located between the firstelectrode and the second electrode. The magnetic tunnel junctioncomprises an iron or Heusler alloy ferromagnetic reference layer, aniron or Heusler alloy ferromagnetic free layer, a (001) texturedmagnesium oxide first tunneling dielectric layer located between one ofthe reference layer or the free layer, and one of the first electrode ofthe second electrode, and a (001) textured MgAl₂O₄ second tunnelingdielectric layer located between the reference layer and the free layer.

According to another embodiment of the present disclosure, a method offorming a magnetoresistive memory device comprises forming a firstelectrode over a substrate, depositing a magnetic tunnel junction layerstack over the first electrode, wherein the magnetic tunnel junctionlayer stack comprises, from one side to another, a firsttexture-breaking nonmagnetic layer including a first nonmagnetictransition metal, a magnesium oxide first tunneling dielectric layerincluding grains having (001) texture, a reference layer including afirst amorphous ferromagnetic material, a spinel second dielectrictunneling layer including an amorphous spinel material, a free layerincluding a second amorphous ferromagnetic material, a magnesium oxidethird tunneling dielectric layer including grains having (001) texture,and a second texture-breaking nonmagnetic layer including a secondnonmagnetic transition metal, performing an anneal process to inducesolid phase epitaxy crystallization of materials of the free layer, thesecond tunneling dielectric layer, and the reference layer using atleast one of the first or the third tunneling dielectric layer as acrystallization template layer, to convert the amorphous spinel materialof the second tunneling dielectric layer into polycrystalline spinelmaterial having (001) texture along an axial direction that isperpendicular to an interface between the second tunneling dielectriclayer and the free layer, and forming a second electrode over a portionof the magnetic tunnel junction layer stack prior to or after the annealprocess.

According to yet another embodiment of the present disclosure, amagnetoresistive memory device comprises a voltage controlled exchangecoupling layer stack comprising a perpendicular magnetic anisotropy(PMA) ferromagnetic layer having a fixed magnetization direction, aferromagnetic free layer, and an electrically conductive nonmagneticinterlayer exchange coupling layer located between the free layer andthe PMA ferromagnetic layer and providing voltage dependent exchangecoupling between the free layer and the PMA ferromagnetic layer, amagnetic tunnel junction comprising a ferromagnetic reference layer, afirst tunneling dielectric layer, a second tunneling dielectric layer,and a metallic quantum well layer located between the first and thesecond tunneling dielectric layers, wherein the magnetic tunnel junctionalso includes the free layer, a first electrode located on a first sideof a combination of the voltage controlled exchange coupling layer stackand the magnetic tunnel junction, and a second electrode located on asecond side of the combination of the voltage controlled exchangecoupling layer stack and the magnetic tunnel junction.

According to another embodiment of the present disclosure, aspin-orbit-torque (SOT) magnetoresistive memory device comprises amagnetic tunnel junction comprising, from one side to another, aferromagnetic free layer, a first tunneling dielectric layer, a metallicquantum well layer, a second tunneling dielectric layer, andferromagnetic reference layer, a first electrode located on thereference layer side the magnetic tunnel junction, a spin Hall effectmetal line contacting a surface of the free layer, a first electricalcontact electrically contacting a first end of the spin Hall effectmetal line, and a second electrical contact electrically contacting asecond end of the spin Hall effect metal line.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a random access memory array ofmagnetic tunnel junction devices according to embodiments of the presentdisclosure.

FIG. 2A is an energy band diagram during a resonant tunneling through amagnetic tunnel junction of embodiments of the present disclosure.

FIG. 2B is an energy band diagram during a non-resonant tunnelingthrough a magnetic tunnel junction of embodiments of the presentdisclosure.

FIG. 3A is plot of calculated normalized resistance versus dielectricbarrier layer thickness in units of atomic monolayers according toembodiments of the present disclosure.

FIG. 3B is plot of calculated tunneling magnetoresistance ratios ofresonant magnetic tunnel junction devices as a function of an appliedvoltage for different thicknesses of a metallic quantum well layeraccording to embodiments of the present disclosure.

FIG. 4A is a vertical cross-sectional view of a first configuration ofan exemplary spin transfer torque magnetoresistive memory deviceaccording to a first embodiment of the present disclosure.

FIG. 4B is a vertical cross-sectional view of a second configuration ofan exemplary spin transfer torque magnetoresistive memory deviceaccording to the first embodiment of the present disclosure.

FIG. 5A is a vertical cross-sectional view of a first configuration ofan exemplary voltage controlled exchange coupling magnetoresistivememory device according to second embodiment of the present disclosure.

FIG. 5B is a vertical cross-sectional view of a second configuration ofan exemplary voltage controlled exchange coupling magnetoresistivememory device according to the second embodiment of the presentdisclosure.

FIG. 6A is a vertical cross-sectional view of a first configuration ofan exemplary spin-orbit-torque magnetoresistive memory device accordingto a third embodiment of the present disclosure.

FIG. 6B is a vertical cross-sectional view of a second configuration ofan exemplary spin-orbit-torque magnetoresistive memory device accordingto the third embodiment of the present disclosure.

FIG. 6C is a vertical cross-sectional view of a third configuration ofan exemplary spin-orbit-torque magnetoresistive memory device accordingto the third embodiment of the present disclosure.

FIG. 6D is a perspective view of an exemplary spin-orbit-torquemagnetoresistive memory device according to the third embodiment of thepresent disclosure.

FIG. 7 is a schematic diagram of another random access memory array ofmagnetic tunnel junction devices according to the third embodiment ofthe present disclosure.

DETAILED DESCRIPTION

Embodiments of the present disclosure are directed to magnetic tunneljunction memory devices employing resonant tunneling, methods ofoperating the same, and methods of manufacturing the same, the variousaspects of which are described in detail herebelow.

The drawings are not drawn to scale. Multiple instances of an elementmay be duplicated where a single instance of the element is illustrated,unless absence of duplication of elements is expressly described orclearly indicated otherwise. Ordinals such as “first,” “second,” and“third” are employed merely to identify similar elements, and differentordinals may be employed across the specification and the claims of theinstant disclosure. The term “at least one” element refers to allpossibilities including the possibility of a single element and thepossibility of multiple elements. The same reference numerals refer tothe same element or similar element. Unless otherwise indicated,elements having the same reference numerals are presumed to have thesame composition and the same function. Unless otherwise indicated, a“contact” between elements refers to a direct contact between elementsthat provides an edge or a surface shared by the elements. If two ormore elements are not in direct contact with each other or among oneanother, the two elements are “disjoined from” each other or “disjoinedamong” one another. As used herein, a first element located “on” asecond element can be located on the exterior side of a surface of thesecond element or on the interior side of the second element. As usedherein, a first element is located “directly on” a second element ifthere exist a physical contact between a surface of the first elementand a surface of the second element. As used herein, a first element is“electrically connected to” a second element if there exists aconductive path consisting of at least one conductive material betweenthe first element and the second element. As used herein, a “prototype”structure or an “in-process” structure refers to a transient structurethat is subsequently modified in the shape or composition of at leastone component therein.

As used herein, a “layer” refers to a material portion including aregion having a thickness. A layer may extend over the entirety of anunderlying or overlying structure, or may have an extent less than theextent of an underlying or overlying structure. Further, a layer may bea region of a homogeneous or inhomogeneous continuous structure that hasa thickness less than the thickness of the continuous structure. Forexample, a layer may be located between any pair of horizontal planesbetween, or at, a top surface and a bottom surface of the continuousstructure. A layer may extend horizontally, vertically, and/or along atapered surface. A substrate may be a layer, may include one or morelayers therein, or may have one or more layer thereupon, thereabove,and/or therebelow. As used herein, a “layer stack” refers to a stack oflayers. As used herein, a “line” or a “line structure” refers to a layerthat has a predominant direction of extension, i.e., having a directionalong which the layer extends the most. As used herein, a “ferromagneticmaterial” refers to any material that exhibits spontaneous ferromagneticpolarization that can be reversed by the application of an externalmagnetic and/or electric field (e.g., exhibits ferromagneticity).

FIG. 1 is a schematic diagram of a magnetoresistive random access memory(MRAM) device 501 including a two-dimensional array of magnetoresistivememory devices 180 according to an embodiment of the present disclosure.As used herein, a “random access memory device” refers to a memorydevice including memory cells that allow random access, i.e., access toany selected memory cell upon a command for reading the contents of theselected memory cell.

The random access memory device 501 of the embodiments of the presentdisclosure may comprise an MRAM device. The device 501 includes a memoryarray region 550 containing an array of respective magnetic devices,such as magnetic tunnel junction devices (e.g., magnetoresistive memorycells) 180 located at intersections of word lines (which may comprisefirst electrically conductive lines 30 as illustrated or as secondelectrically conductive lines 90 in an alternate configuration) and bitlines (which may comprise second electrically conductive lines 90 asillustrated or as first electrically conductive lines 30 in an alternateconfiguration). For example, the first electrically conductive lines 30may be electrically connected to, and/or may comprise, bottom electrodesof a respective row of magnetoresistive memory devices 180 in the memoryarray region 550, while the second electrically conductive lines 90 maybe electrically connected to, and/or may comprise, top electrodes of arespective column of magnetoresistive memory devices 180 in the memoryarray region 550.

The random access memory device 501 may also contain a row decoder 560connected to the word lines, a sensing and programming circuit 570(which may include sense amplifiers, programming transistors, andcontrol circuits) connected to the bit lines, a column decoder 580connected to the bit lines, and a data buffer 590 connected to the sensecircuitry. The magnetoresistive memory devices 180 are provided in anarray configuration that forms the random access memory device 501. Inone embodiment, the magnetoresistive memory devices 180 may be providedas a rectangular array. As such, each of the magnetoresistive memorydevices 180 can be a two-terminal device including a respective firstelectrode and a respective second electrode. It should be noted that thelocation and interconnection of elements are schematic, and the elementsmay be arranged in a different configuration. Further, amagnetoresistive memory device 180 may be manufactured as a discretedevice, i.e., a single isolated device.

The random access configuration illustrated in the random access memorydevice 501 is only exemplary, and the magnetoresistive memory devices180 of the embodiments of the present disclosure can be connected indifferent interconnection configurations.

Referring to FIGS. 2A and 2B, energy band diagrams are shown for amagnetic tunnel junction within an exemplary magnetoresistive memorydevice 180 of an embodiment of the present disclosure. Themagnetoresistive memory device 180 can include, from one side toanother, a first metallic contact layer 20, a first tunneling dielectriclayer 131, a ferromagnetic reference layer 134, a second tunnelingdielectric layer 133, a ferromagnetic free layer 144, a third tunnelingdielectric layer 135, and a second metallic contact layer 80. Accordingto an aspect of the present disclosure, each of the reference layer 134and the free layer 144 can be thin enough to have discrete (quantized)energy levels as a respective two-dimensional quantum well. For example,each of the reference layer 134 and the free layer 144 can have arespective thickness that corresponds to an integer number ofmonolayers. The integer number may be, for example, in a range from 1 to5. Preferably, each of the reference layer 134 and the free layer 144are one, two or three monolayers thick. For example, each of thereference layer 134 and the free layer 144 can have a respectivethickness in a range from 0.3 nm to 2 nm, such as 0.5 nm to 2 nm,although a greater thickness may also be employed. Optionally, each ofthe reference layer 134 and the free layer 144 is thinner than at leastone of the tunneling dielectric layers (131, 133, 135). The tunnelingdielectric layers act as energy barriers to the reference layer 134 andthe free layer 144 which function as quantum wells.

According to an aspect of the present disclosure, discrete energy levels(i.e., quantum well resonant states) of the reference layer 134 and thefree layer 144 within the magnetoresistive memory device 180 between thefirst metallic contact layer 20 and the second metallic contact layer 80can have matched energy levels that are within 0.1 eV from the Fermienergy level (E_(F)) of the first metallic contact layer 20 and/or thesecond metallic contact layer 80. This energy level matching leads toresonant tunneling through the magnetoresistive memory device 180 uponapplication of a current or voltage between the first metallic contactlayer 20 and the second metallic contact layer 80 when the magnetizationof the free layer 144 is parallel to the magnetization of the referencelayer 134. In contrast, when the magnetization of the free layer 144 isantiparallel to the magnetization of the reference layer 134, the energylevel (i.e., resonant state) of the free layer is not matched to eitherenergy level (i.e., resonant state) of the reference layer 134 or theFermi energy level of the contact layers (20, 80). In this state,resonant tunneling through the magnetoresistive memory device 180 isinhibited or prevented by the free layer 144 (i.e., the resonanttunneling through the reference layer 134 stops at the free layer 144).

The difference in the energy levels of the parallel state and theantiparallel state of the free layer 144 is large enough such thatresonant tunneling does not occur while the free layer 144 is in theantiparallel state relative to the reference layer 144. In theillustrated example of FIGS. 2A and 2B, the resonant tunneling (shown bythe dashed arrows) occurs between the first metallic contact layer 20and the second metallic contact layer 80 while the magnetization of thefree layer 144 is in the parallel state to the fixed magnetizationdirection of the reference layer 134. However, the resonant tunnelingdoes not occur while the free layer 144 is in the antiparallel state tothe fixed magnetization direction of the reference layer 134. In theantiparallel state, the free layer 144 has an energy level (i.e.,resonant state) which differs by more than 0.1 eV from the Fermi energylevel of the first metallic contact layer 20 and/or the second metalliccontact layer 80. For example, as shown in FIG. 2B, the energy level ofthe free layer 144 is more than 0.1 eV higher than the Fermi energylevel, which inhibits resonant tunneling through the device 180 betweenthe first metallic contact layer 20 and the second metallic contactlayer 80.

Resonant tunneling, or resonant electron tunneling, refers to a quantumphenomenon in which electrons tunnel through the quantum well stateformed in the conductive metallic layer(s) between the insulatingbarriers.

Resonant tunneling significantly increases the tunneling current througha tunnel junction structure. Tunneling magnetoresistance ratio (TMR),which is defined as the ratio of a magnetoresistance of a higherresistance state to a magnetoresistance of a lower resistance state, canbe significantly increased if the lower resistance state corresponds toa state having resonant tunneling and if the higher resistance statecorresponds to a state without resonant tunneling.

Without wishing to be bound by a particular theory, the presentinventors realized that generally, a thicker insulating barrier (i.e.,tunneling dielectric layer) strongly increases the tunnelingmagnetoresistance ratio. The table below shows a result of tight bindingcalculations of TMR in triple barrier magnetic tunnel junction (MTJ)that consists of three MgO barrier layers (131, 133, 135) and Fereference and free layers (i.e., a MgO/Fe/MgO/Fe/MgO structure shown inFIGS. 2A and 2B) coupled to two non-magnetic electrodes (20, 80).

Number of monolayers in tunneling dielectric layers I_(P) ^(†) I_(P)^(†) I_(AP) ^(†) I_(AP) ^(†) (1341, 133, 135) (A/cm²) (A/cm²) (A/cm²)(A/cm²) TMR (%) 131 = 1. 133 = 1, 135 = 1 1.15E+04 2.35 8.87E+018.76E+01 6,423 131 = 2, 133 = 2, 135 = 2 1.21E+02 1.46E−04 2.41E−022.37E−02 252,564 131 = 2, 133 = 4, 135 = 2 5.57 2.38E−07 1.69E−051.65E−05 16,642,093

Results of calculations shown in the above table correspond to the casewhen spin dependent resonance state for spin-up electrons is close tothe Fermi level, while the state for spin-down electrons is away fromthe Fermi level. As a result, the tunneling current for spin-upelectrons at parallel configuration dominates, leading to higher TMR.Thicker tunneling dielectric layers (i.e., potential barriers) (131,133, 135) strongly increase this effect, since transmission probabilitythrough the resonant state becomes much higher compared to transmissionprobability without the resonant state. As can be seen in the third rowof the above table, when the tunneling dielectric layers 131, 133 and135 have a thickness of two, four and two monolayers, respectively, theTRM value is over sixteen million. In contrast, when each tunnelingdielectric layer has a thickness of one monolayer, the TMR value is lessthan ten thousand.

However, a thicker insulating barrier also increases a resistance-areaproduct (RA). Without wishing to be bound by a particular theory, thepresent inventors determined that the resistance-area product increasesmuch slower with the barrier thickness in case of resonant tunnelingcompared to non-resonant tunneling, as shown in FIG. 3A. Line 2corresponds to the contribution of spin down electrons into thetunneling current for the case where the magnetization directions of thereference layer 134 and the free layer 144 are parallel. In this casethe layers have energy levels (i.e., resonant states) which are notmatched to the Fermi energy level of the electrodes (i.e., the firstmetallic contact layer 20 and the second metallic contact layer 80).Line 4 corresponds to the case shown in FIG. 2B where the magnetizationdirections of the reference layer 134 and the free layer 144 areantiparallel to each other, and an energy level (i.e., resonant state)of one of these layers is not matched to the Fermi energy level of theelectrodes. Line 6 indicates the contribution of spin-up electrons intothe tunneling current corresponding to the case shown in FIG. 2A wherethe magnetization directions of the reference layer 134 and the freelayer 144 are parallel. In this case these layers have energy levels(i.e., resonant states) which are matched to the Fermi energy level ofthe electrodes (i.e., the first metallic contact layer 20 and the secondmetallic contact layer 80).

During non-resonant tunneling, electrons can tunnel through a multipleenergy barrier structures through consecutive tunneling through eachenergy barrier. Tunneling through each energy barrier is governed byindependent tunneling probabilities. The resistance-area produceincreases exponentially with the total energy barrier thickness. Incontrast, during resonant tunneling, the tunneling resistance is notequal to the sum of individual resistances since the electron transportthrough multiple barriers becomes an entire quantum tunneling event.Typically, the overall resistance-area product increases byapproximately 4 orders of magnitude when the thicknesses of all barrierlayers double for non-resonant tunneling. The overall resistance-areaproduct increases by approximately 2 orders of magnitude when thethickness of all barrier layers double for resonant tunneling.

Referring to FIG. 3B, calculated tunneling resistance ratios of resonantmagnetic tunnel junction devices of the present disclosure areillustrated as a function of an applied bias voltage. Different curvescorrespond to different thicknesses of ferromagnetic quantum welllayers, which may be a reference layer 134 and a free layer 144. Thetunneling dielectric layers 131, 133, 135 comprise two monolayer thickMgO layers in each case. The device 180 TMR increases significantly from5,500% for five monolayer thick reference and free layers to 250,000%for one monolayer thick reference and free layers. In other words, theTMR of the device 180 may be at least 100,000%, such as 200,000% to16,642,093%.

Thus, in one embodiment of the present disclosure, the device 180includes two or more tunneling dielectric layers (i.e., potentialbarriers), such as three tunneling dielectric layers (131, 133, 135).Optionally, at least one of the two or more tunneling dielectric layersis thicker than each of the reference layer 134 and the free layer 144,for some ferromagnetic reference and free layer materials, such as iron.In this optional embodiment, each of the two or more, such as each ofthe three tunneling dielectric layers (131, 133, 135) is thicker thaneach of the reference layer 134 and the free layer 144. In oneembodiment, at least one of the two or more tunneling dielectric layersis at least 50%, such as at least 100% (i.e., at least two times),including two to five time thicker than each of the reference layer 134and the free layer 144. In one embodiment, each of the two or more, suchas each of the three tunneling dielectric layers (131, 133, 135) is atleast 50%, such as at least 100% (i.e., at least two times), includingtwo to five time thicker than each of the reference layer 134 and thefree layer 144. However, in other embodiments, the reference and freelayers may be thicker than the tunneling dielectric layers depending onthe specific materials and other conditions.

Referring to FIGS. 4A and 4B, an exemplary spin transfer torque (“STY”)magnetoresistive memory device according to a first embodiment of thepresent disclosure is illustrated. The illustrated magnetoresistivememory device 180 of FIGS. 4A and 4B may be a STT magnetoresistivememory cell within the array of magnetoresistive memory devices 180illustrated in FIG. 1. Each of the magnetoresistive memory devices 180can be formed over a substrate. In an illustrative example, thesubstrate may comprise a combination of a semiconductor substrate (notexpressly shown), semiconductor devices (e.g., driver circuit devices,such as field effect transistors, resistors, diodes, capacitors, etc.)for operating the array of magnetoresistive memory devices 180 to beformed thereupon, and dielectric material layers (not expressly shown)embedding metal interconnect structures (not expressly shown) andoverlying the semiconductor devices. The metal interconnect structurescan provide electrical connection between nodes of the semiconductordevices in the substrate, and can be configured to provide electricalconnection to the array of magnetoresistive memory devices 180 throughfirst electrically conductive lines 30 and second electricallyconductive lines 90.

In an alternative configuration in which each magnetoresistive memorydevice 180 is a discrete memory cell which is individually addressed bya dedicated steering (i.e., selector) element (e.g., access transistor,diode or Ovonic threshold switch device, of which the number can be thesame as the number magnetoresistive memory devices 180), a pair ofdedicated electrically conductive paths that are not shared with othermagnetoresistive memory devices 180 can contact the first electrode 112and the second electrode 170. While not illustrated in the drawings, thesteering (i.e., selector) element may be inserted between amagnetoresistive memory device 180 and one of the access lines (30 or90). Generally, the illustrated magnetoresistive memory device 180 ofFIG. 4A can be incorporated into any circuit setting that enabledetection of tunneling magnetoresistance.

In case first electrically conductive lines 30 and second electricallyconductive lines 90 are used as access lines (e.g., bit lines and wordlines), a lower set of access lines (which may be the first electricallyconductive lines 30 or the second electrically conductive lines 90depending on the configuration) may be formed on, or within, alower-level dielectric layer 110. Lines 30 may comprise word lines andlines 90 may comprise bit lines or vice-versa. A material layer stackcan be deposited over the top surface of the lower-level dielectriclayer 110, and can be patterned to form a two-dimensional array ofmagnetoresistive memory devices 180. A memory-level dielectric layer 190can be formed around the two-dimensional array of magnetoresistivememory devices 180, and can be planarized to provide a horizontal topsurface that is planar with the top surfaces of the magnetoresistivememory devices 180. An upper-level dielectric layer 199 embedding anupper set of access lines can be formed. In one embodiment, the lowerset of access lines can be first electrically conductive lines 30 andthe upper set of access lines can be second electrically conductivelines 90. Alternatively, the lower set of access lines can be secondelectrically conductive lines 90 and the upper set of access lines canbe first electrically conductive lines 30.

In one embodiment, the lower-level dielectric layer 110 and theupper-level dielectric layer 199 include a respective dielectricmaterial such as undoped silicate glass, a doped silicate glass,organosilicate glass, or silicon nitride. The thickness of each of thelower-level dielectric layer 110 and the upper-level dielectric layer199 may be in a range from 50 nm to 600 nm, such as from 100 nm to 300nm, although lesser and greater thicknesses can also be employed. Eachof the first electrically conductive lines 30 and the secondelectrically conductive lines 90 may include a high electricalconductivity metal such as tantalum, tungsten, titanium, copper,molybdenum, ruthenium, a stack thereof, or an alloy thereof. In oneembodiment, each of the first electrically conductive lines 30 and thesecond electrically conductive lines 90 may include a combination of aconductive metallic barrier liner including TiN, TaN, and/or WN and aconductive fill material located inside the metallic barrier liner. Theconductive fill material may include copper, tungsten, molybdenum,tantalum, titanium, ruthenium, etc. The thickness of the firstelectrically conductive lines 30 and the second electrically conductivelines 90 can be in a range from 50 nm to 600 nm, such as from 100 nm to300 nm, although lesser and greater thicknesses can also be employed.

The material layer stack is deposited over the top surface of thelower-level dielectric layer 110 to provide a two-dimensional array ofmagnetoresistive memory devices 180. The material layer stack caninclude, from bottom to top, a first electrode layer (that issubsequently patterned to form a first electrode 112), a magnetic tunneljunction 150 layer stack, and a second electrode layer (that issubsequently patterned to form a second electrode 170). The magnetictunnel junction 150 layer stack can include, from bottom to top or fromtop to bottom, an optional synthetic antiferromagnetic (SAF) structure120 layer stack, an optional first amorphous nonmagnetic metal layer(e.g., first texture breaking layer) 122, a first tunneling dielectriclayer 131, a ferromagnetic reference layer 134 which is a metallicquantum well layer having discrete energy states, a second tunnelingdielectric layer 133, a ferromagnetic free layer 144 with is a metallicquantum well layer having discrete energy states, a third tunnelingdielectric layer 135, and an optional second amorphous nonmagnetic metallayer (e.g., second texture breaking layer) 166. A metallic cap layer172 may be optionally formed between the second electrode 170 and thesecond electrically conductive line 90.

The first electrode layer includes a nonmagnetic transition metal, andmay include one or more of Ta, Ti, V, Cr, Mn, Zr, Nb, Mo, Tc, Ru, Rh,Hf, W, Re, Os, and Ir. In one embodiment, the first electrode layer caninclude tantalum. The first electrode layer can be deposited, forexample, by sputtering. The first electrode layer can have a thicknessin a range from 5 nm to 20 nm. The first electrode layer may bedeposited as a polycrystalline layer. Optionally, an anneal process maybe performed to induce crystallization of the first electrode layer. Inone embodiment, the first electrode layer may include, and or mayconsist essentially of, tantalum.

The SAF structure 120 layer stack (if present) includesantiferromagnetically coupled layers, which may containing at least oneferromagnetic material layer, at least one non-magnetic spacer layer andat least one second ferromagnetic layer. Alternatively, a hardmagnetization layer may be used instead of the SAF structure 120 orinside the SAF structure 120 to fix the magnetization direction of thereference layer 134.

The optional first amorphous nonmagnetic metal layer 122, if present,can include a first nonmagnetic transition metal, which may be tungsten,tantalum, niobium, molybdenum, rhenium, platinum, ruthenium, palladium,iridium, or an alloy thereof. The optional first amorphous nonmagneticmetal layer 122 includes a nonmagnetic transition metal having a meltingpoint of at least 1,500 degrees Celsius so that bulk diffusion withinthe optional first amorphous nonmagnetic metal layer 122 is insufficientto cause further crystallization therein or to function as a templatefor solid phase epitaxy in a subsequent anneal process. The optionalfirst amorphous nonmagnetic metal layer 122 may be deposited as anamorphous material by physical vapor deposition performed at roomtemperature. The thickness of the optional first amorphous nonmagneticmetal layer 122 can have a thickness in a range from 0.2 nm to 1 nm. Thefirst amorphous nonmagnetic metal layer 122 may function as a texturebreaking layer which breaks the <111> direction texture of theunderlying polycrystalline first electrode layer.

The first tunneling dielectric layer 131 can be formed by depositing adielectric metal oxide material, which may include, and/or may consistessentially of, MgO, MgAl₂O₄, ZnAl₂O₄, SiMg₂O₄, SiZn₂O₄, MgGa₂O₄,Mg—Al—O_(x) (which could be a disordered spinel structure), dopedderivatives therefrom in which a fraction of at least one metallicelement or silicon is replaced with another metallic element or siliconwhile preserving the crystalline structure, and oxygen-deficientderivatives thereof.

In case the first tunneling dielectric layer 131 includes magnesiumoxide, the first tunneling dielectric layer 131 may have predominantly(001) texture. As used herein, a crystallographic plane texture in amaterial layer refers to a growth condition or a crystalline structurein which grains having crystallographic orientations that areperpendicular to the crystallographic plane are predominant, i.e.,occupy more than 50% of the entire volume of the material layer. Forexample, (001) texture in a material layer refers to a growth conditionor a crystalline structure in which grains having growth directions orhaving axial directions that are perpendicular to the (001) plane occupymore than 50% of the entire volume of the material layer. In otherwords, (001) texture in a material layer refers to a growth condition ora crystalline structure in which grains having a <001> direction as agrowth direction or as an axial direction occupy more than 50% of theentire volume of the material layer. As used herein, an axial directionrefers to the direction that is perpendicular to the planes of theinterfaces between neighboring layers. The volume fraction of grainshaving (001) planes along the growth plane (i.e., having a <001>direction as the axial direction) within the magnesium oxide material ofthe first tunneling dielectric layer 131 can be in a range from 0.5 to1, such as from 0.8 to 0.99.

In another embodiment, the first tunneling dielectric layer 131 includesan amorphous spinel material. As used herein, a “spinel” refers to adielectric compound having a formula of M₁Q₂O₄, in which M and Q aremetals or silicon, and the dielectric compound has a crystallinestructure with a space group of F43m. Exemplary spinels include MgAl₂O₄,ZnAl₂O₄, SiMg₂O₄, SiZn₂O₄, MgGa₂O₄, doped derivatives therefrom in whicha fraction of at least one metallic element is replaced with anothermetallic element while preserving the crystalline structure, andoxygen-deficient derivatives or disordered spinel derivatives (e.g.,Mg—Al-Ox) thereof. In one embodiment, the amorphous spinel material ofthe first tunneling dielectric layer 131 can be deposited directly onthe first amorphous nonmagnetic metal layer 122. The first tunnelingdielectric layer 131 can be formed by physical vapor deposition (e.g.,sputtering) or vacuum evaporation of source materials includingcomponent atoms of the spinel material. The thickness of the firsttunneling dielectric layer 131 can be in a range from 0.5 nm to 2 nm,such as 0.8 nm to 1 nm, although lesser and greater thicknesses can alsobe employed.

The reference layer 134 can be formed by depositing a first amorphousferromagnetic material. For example, the reference layer 134 can includean amorphous Fe layer, CoFe layer, a CoFeB layer, an amorphous stack ofCo/Ni multilayers or Co/Pt multilayers. The reference layer 134 may bedeposited as an amorphous material by physical vapor depositionperformed at room temperature. In one embodiment, the reference layer134 can comprise, and/or can consist essentially of, a ferromagneticmaterial in which a total atomic percentage of Fe, Co, Ni, and B is atleast 80%. In another embodiment, the reference layer 134 comprises,and/or consists essentially of, a Heusler alloy. The thickness of thereference layer 134 can be in a range from 0.5 nm to 2 nm, such as 0.8nm to 1.2 nm, although lesser and greater thicknesses can also beemployed.

The second tunneling dielectric layer 133 may include any of thedielectric metal oxide materials that may be employed for the firsttunneling dielectric layer 131. In a preferred embodiment, the firsttunneling dielectric layer 131 comprises MgO having the (001) texture,and the second tunneling dielectric layer 133 which is located betweenthe reference layer 134 and the free layer 144 comprises an amorphousstoichiometric or disordered spinel material, such as MgAl₂O₄ orMg—Al—O_(x). The thickness of the second tunneling dielectric layer 133can be in a range from 0.8 nm to 2 nm, such as 0.8 nm to 1.2 nm,although lesser and greater thicknesses can also be employed. In oneembodiment, the second tunneling dielectric 133 may be thicker than thefirst and third tunneling dielectric layers (131, 135) by one or moreatomic monolayers.

Optionally, as shown in FIG. 4B, an additional reference layer 154 maybe formed, which can have the same energy level, the same materialcomposition, and the same thickness range as the reference layer 134.Optionally, an additional tunneling dielectric layer 137 may be formed,which can have any of the dielectric metal oxide material that may beemployed for the first tunneling dielectric layer 131 and/or the secondtunneling dielectric layer 133, and may have the same thickness range asthe first tunneling dielectric layer 131 and/or the second tunnelingdielectric layer 133.

Referring to both FIGS. 4A and 4B, the free layer 144 can be formed bydepositing a second amorphous ferromagnetic material. For example, thefree layer 144 can include an amorphous Fe layer, a CoFe layer, a CoFeBlayer, an amorphous stack of Co/Ni multilayers or Co/Pt multilayers. Thefree layer 144 may be deposited as an amorphous material by physicalvapor deposition performed at room temperature. In one embodiment, thefree layer 144 can comprise, and/or can consist essentially of, aferromagnetic material in which a total atomic percentage of Fe, Co, Ni,and B is at least 80%. In another embodiment, the free layer 144comprises, and/or consists essentially of, a Heusler alloy. Thethickness of the free layer 144 can be in a range from 0.5 nm to 2 nm,such as 0.8 nm to 1.2 nm, although lesser and greater thicknesses canalso be employed.

In one embodiment, each of the reference layer 134 and the free layer144 comprises, and/or consists essentially of, a respectiveferromagnetic material in which a total atomic percentage of Fe is atleast 80%, and may consist essentially of iron with unavoidableimpurities. In another embodiment, each of the reference layer 134 andthe free layer 144 comprises a respective Heusler alloy. The Heusleralloy layer may include any suitable ferromagnetic alloy having aformula M₂TX, where M is a first transition metal, T is a secondtransition metal different from the first transition metal and X is anelement from Groups 13 to 17 of the Periodic Table of elements. Forexample, M may be Co, Ni, Fe, Pd and/or Mn, T may be Fe, Mn and/or V andX may be Si, Al, Ge, Sb, Ga and/or Sn. For example, the ferromagneticalloy may consist essentially a cobalt-iron-aluminum (e.g., Co₂FeAl)alloy or a cobalt-manganese-germanium (Co₂MnGe) alloy.

The third tunneling dielectric layer 135 may include any of thedielectric metal oxide materials that may be employed for the firsttunneling dielectric layer 131, and may have the same thickness range asthe first tunneling dielectric layer 131. For example, the thirdtunneling dielectric layer 135 may comprise MgO with (001) texture andhaving a thickness in a range from 0.5 nm to 2 nm, such as 0.8 nm to 1nm, although lesser and greater thicknesses can also be employed.

At least one of the first tunneling dielectric layer 131, the secondtunneling dielectric layer 133, and the third tunneling dielectric layer135 can be formed with (001) texture. In other words, a predominantportion of at least one of the first tunneling dielectric layer 131, thesecond tunneling dielectric layer 133, and the third tunnelingdielectric layer 135 can be formed with (001) texture is formed with a<001> growth direction with a (001) growth plane. In one embodiment, atleast one of the first tunneling dielectric layer 131, the secondtunneling dielectric layer 133, and the third tunneling dielectric layer135 can be formed with (001) texture comprises a magnesium oxide layer.The propensity to provide (001) texture in the deposited magnesium oxidecapping dielectric layer is an inherent crystalline property ofmagnesium oxide. The deposition temperature for the third tunnelingdielectric layer 135 can be room temperature. In one embodiment, each ofthe tunneling dielectric layers (131, 133, 135) may include magnesiumoxide. In one embodiment, at least one of the first tunneling dielectriclayer 131, the second tunneling dielectric layer 133, and the thirdtunneling dielectric layer 135 can include a magnesium oxide layer, andat least another of the first tunneling dielectric layer 131, the secondtunneling dielectric layer 133, and the third tunneling dielectric layer135 can include a spinel layer.

The optional second amorphous nonmagnetic metal layer 166 can include asecond nonmagnetic transition metal, which may be tungsten, tantalum,niobium, molybdenum, rhenium, platinum, palladium, iridium, or an alloythereof. The optional second amorphous nonmagnetic metal layer 166includes a nonmagnetic transition metal having a melting point of atleast 1,500 degrees Celsius so that bulk diffusion within the optionalsecond amorphous nonmagnetic metal layer 166 is insufficient to causefurther crystallization therein or to function as a template for solidphase epitaxy in a subsequent anneal process. The first nonmagnetictransition metal of the optional first amorphous nonmagnetic metal layer122 and the second nonmagnetic transition metal of the optional secondamorphous nonmagnetic metal layer 166 may be selected independently. Inone embodiment, the first nonmagnetic transition metal and the secondnonmagnetic transition metal may be tungsten. The optional secondamorphous nonmagnetic metal layer 166 may be deposited as an amorphousmaterial by physical vapor deposition performed at room temperature. Thethickness of the optional second amorphous nonmagnetic metal layer 166can have a thickness in a range from 0.2 nm to 1 nm. The secondamorphous nonmagnetic metal layer 166 can also function as a texturebreaking layer.

The second electrode layer includes a nonmagnetic transition metal, andmay include one or more of Ta, Ti, V, Cr, Mn, Zr, Nb, Mo, Tc, Ru, Rh,Hf, W, Re, Os, and Ir. The second electrode layer may be deposited bysputtering. The thickness of the second electrode layer can be in arange from 2 nm to 10 nm, such as from 3 nm to 8 nm, although lesser andgreater thicknesses can also be employed.

The optional metallic cap layer 172 includes a nonmagnetic transitionmetal, and may include one or more of Ta, Ti, V, Cr, Mn, Zr, Nb, Mo, Tc,Ru, Rh, Hf, W, Re, Os, and Ir. The metallic cap layer 172 may bedeposited by sputtering. The thickness of the metallic cap layer 172 canbe in a range from 2 nm to 10 nm, such as from 3 nm to 8 nm, althoughlesser and greater thicknesses can also be employed. In one embodiment,the second electrode layer can include tantalum, and the metallic caplayer 172 can include ruthenium.

A post-deposition anneal process can be performed at an elevatedtemperature in a range from 250 degrees Celsius to 500 degrees Celsiusoptionally in the presence of a vertical magnetic field. Generally, theelevated temperature of the anneal process is selected such that solidphase epitaxy of amorphous materials of the free layer 144, thereference layer 134, and any amorphous material within the tunnelingdielectric layers (131, 133, 135). As discussed above, at least one ofthe tunneling dielectric layers (131, 133, 135) includes apolycrystalline material with (001) texture. The polycrystalline layerwith the (001) texture functions as a template layer for the solid phaseepitaxy process to enhance epitaxial alignment among grains across thevarious layers between the amorphous nonmagnetic metal layers (122,166).

In an illustrative example, if the first tunneling dielectric layer 131and/or the third tunneling dielectric layer 135 comprise MgO layerswhich have (001) texture, and if the second tunneling dielectric layer133 is an amorphous spinel layer, the first amorphous nonmagnetic metallayer 122 can be employed to block propagation of any crystallinestructure from the first electrode 112 and the second amorphousnonmagnetic metal layer 166 can be employed to block propagation of anycrystalline structure from the second electrode 170.

During the thermal anneal process, the grains in the amorphous tunnelingdielectric layer(s) grow and merge with (001) texture. In oneembodiment, the entirety of any amorphous material of the tunnelingdielectric layers (131, 133, 135), the amorphous material of thereference layer 134, and the amorphous material of the free layer 144crystallizes with (001) large textured grains that occupies apredominant volume (such a more than 80%, and/or more than 90%, and/ormore than 95%, and/or more than 98%, and/or more than 99%) of eachlayer. In one embodiment, the thermal anneal process comprises the solidphase epitaxy process.

For example, (001) textured crystal structure propagates from one orboth of MgO first tunneling dielectric layers (131, 135) through thestack of the reference layer 134, amorphous spinel second tunnelingdielectric layer 133 and free layer 144 to crystallize them withpreferred (001) orientation. The lattice matching between the amorphousspinel second tunneling dielectric layer 133 and the reference and freelayers (134, 144) may be improved if the amorphous spinel secondtunneling dielectric layer 133 comprises MgAl₂O₄ and the reference andfree layers (134, 144) consist essentially of iron or consistsessentially of a ferromagnetic Heusler alloy, such as Co₂FeAl orCo₂MnAl. This improves the quality of the interface between theamorphous spinel second tunneling dielectric layer 133 and the referenceand free layers (134, 144) which improves the resonant tunneling effect.Furthermore, a large perpendicular magnetic anisotropy (PMA) energy maybe obtained due to a reduction of the bulk anisotropy contribution. Inthis embodiment, the reference layer 134 and/or the free layer 144 mayhave the same thickness or a greater thickness or a smaller thicknessthan each of the tunneling dielectric layers (131, 133, 135) whileretaining the high TMR due to the improved interface between the abovelayers.

Grains in each layer between the optional first amorphous nonmagneticmetal layer 122 and the optional second amorphous nonmagnetic metallayer 166 (and/or between the hard magnetization layer 120 and thesecond electrode 170) are oriented along the (001) direction after thesolid phase epitaxy process. Each of the tunneling dielectric layers(131, 133, 135), the reference layer 134, and the free layer 144 hashighly (001)-textured grains that are epitaxially aligned acrossmultiple layers. The average grain size (i.e., the diameter of a spherehaving the same volume as the average volume of the grains) can be onthe order of the thickness of each layer or larger. For example, theaverage grain size of grains in each tunneling dielectric layer (131,133, 135) may be in a range from 1 nm to 4 nm, although lesser andgreater grain sizes can also be employed.

Subsequently, the upper-level dielectric layer 199 embedding the upperset of access lines can be formed. In one embodiment, the lower set ofaccess lines can be first electrically conductive lines 30 and the upperset of access lines can be second electrically conductive lines 90. Eachsecond electrode 170 can be electrically contacted by one of the upperset of access lines (such as a second electrically conductive line 90).

According to the first embodiment of the present disclosure illustratedin FIGS. 4A and 4B, a magnetoresistive memory device comprises a firstelectrode 112, a second electrode 170, and a magnetic tunnel junction150 located between the first electrode and the second electrode. Themagnetic tunnel junction 150 comprises a ferromagnetic reference layer134, a ferromagnetic free layer 144, a first tunneling dielectric layer131 located between one of the reference layer or the free layer, andone of the first electrode of the second electrode, and a secondtunneling dielectric layer 133 located between the reference layer andthe free layer.

In one optional embodiment each of the first and the second tunnelingdielectric layers (131, 133) is at least 50% thicker than each of thereference layer 134 and the free layer 144. In one optional embodimenteach of the first and the second tunneling dielectric layers is at leasttwo times thicker than each of the reference layer and the free layer.

In one embodiment, the free layer 144 has two stable magnetizationstates which comprise a parallel state having a parallel magnetizationdirection that is parallel to a fixed magnetization direction of thereference layer 134, and an antiparallel state having an antiparallelmagnetization direction that is antiparallel to the fixed magnetizationdirection of the reference layer, an energy level of one of a parallelstate and an antiparallel state of the free layer matches an energylevel of the reference layer within 0.1 eV, and an energy level ofanother of the parallel state and the antiparallel state of the freelayer is offset from the energy level of the reference layer at least by0.1 eV.

Quantum well states (QWS's) in ferromagnetic layers are spin-dependent.In other words, an electron with spin-up and spin-down (spin up/downmeans the direction of conduction electron spins are along/opposite tothe direction of the magnetization, respectively) have different energylevels. If a thickness of a ferromagnetic material of the reference andfree layers is selected such that a QWS for spin-up electrons is at(e.g., equals to or differs by a small energy, such as by less than 0.1eV) the Fermi level of at least one of the first and the secondelectrodes, while for spin-down electrons QWS is away (i.e., differs byat least 0.1 eV from the Fermi level. In the parallel state where thefree layer magnetization is parallel to the reference layermagnetization, electrons with spin-up would tunnel through QWSs in bothferromagnetic layers leading to resonant tunneling. In contrast,electrons with spin-down would tunnel in off-resonant state andtherefore their contribution to transport can be neglected. In theantiparallel state, electrons with spin-up in one ferromagnetic layerbecome spin-down electrons for another ferromagnetic layer and viceversa. In this case resonant tunneling through entire structure does notoccur. The above may be summarized in a short hand notation as an energylevel (i.e., QWS) of the parallel state of the free layer matches anenergy level of the reference layer and a Fermi energy level of at leastone of the first and the second electrodes within 0.1 eV, and an energylevel of the antiparallel state of the free layer is offset from theenergy level of the reference layer and the Fermi energy level of atleast one of the first and the second electrodes at least by 0.1 eV.

In one embodiment each of the reference layer 134 and the free layer 144comprises a respective ferromagnetic material in which a total atomicpercentage of Fe, Co, Ni, and B is at least 80%. For example, in a oneembodiment, each of the reference layer and the free layer consistessentially of iron, the first tunneling dielectric layer comprises MgOand the second tunneling dielectric comprises MgAl₂O₄. In anotherembodiment, embodiment each of the reference layer and the free layercomprise a Heusler alloy, the first tunneling dielectric layer comprisesMgO and the second tunneling dielectric comprises MgAl₂O₄. The device180 may comprise a STT MRAM memory cell.

In one embodiment shown in FIG. 4B, the device 180 further comprises athird tunneling dielectric layer 135 located between another one of thereference layer or the free layer, and another one of the firstelectrode of the second electrode. The device 180 may also comprise afirst nonmagnetic texture break metal layer 122 located between thefirst electrode 112 and the magnetic tunnel junction 150, and a secondtexture break nonmagnetic metal layer 166 located between the magnetictunnel junction 150 and the second electrode 170.

In another aspect of the first embodiment, a magnetoresistive memorydevice 180 comprises a first electrode 112, a second electrode 170, anda magnetic tunnel junction 150 located between the first electrode andthe second electrode. The magnetic tunnel junction 150 comprises an ironor Heusler alloy ferromagnetic reference layer 134, an iron or Heusleralloy ferromagnetic free layer 144, a (001) textured magnesium oxidefirst tunneling dielectric layer 131 located between one of thereference layer or the free layer, and one of the first electrode of thesecond electrode, and a (001) textured MgAl₂O₄ second tunnelingdielectric layer 133 located between the reference layer 134 and thefree layer 144. The grains of the free layer 144 may have (001) textureand be epitaxially aligned to grains the second tunneling dielectriclayer 133.

According to another aspect of the first embodiment of the presentdisclosure, a method of forming the magnetoresistive memory device 180comprises forming a first electrode 112 over a substrate, depositing amagnetic tunnel junction 150 layer stack over the first electrode,wherein the magnetic tunnel junction layer stack comprises, from oneside to another, a first texture-breaking nonmagnetic layer 122including a first nonmagnetic transition metal, a magnesium oxide firsttunneling dielectric layer 131 including grains having (001) texture, areference layer 134 including a first amorphous ferromagnetic material,a spinel second dielectric tunneling layer 133 including an amorphousspinel material, a free layer 144 including a second amorphousferromagnetic material, a magnesium oxide third tunneling dielectriclayer 135 including grains having (001) texture, and a secondtexture-breaking nonmagnetic layer 166 including a second nonmagnetictransition metal, performing an anneal process to induce solid phaseepitaxy crystallization of materials of the free layer, the secondtunneling dielectric layer, and the reference layer using at least oneof the first or the third tunneling dielectric layer as acrystallization template layer, to convert the amorphous spinel materialof the second tunneling dielectric layer into polycrystalline spinelmaterial having (001) texture along an axial direction that isperpendicular to an interface between the second tunneling dielectriclayer and the free layer, and forming a second electrode over a portionof the magnetic tunnel junction layer stack prior to or after the annealprocess.

In one embodiment the solid phase epitaxy converts each of the referencelayer 134 and the free layer 144 into polycrystalline iron or Heusleralloy ferromagnetic material layers having (001) texture. In oneembodiment, the spinel material comprises MgAl₂O₄. In one embodiment,each of the first texture-breaking nonmagnetic layer and the secondtexture-breaking nonmagnetic layer blocks propagation of crystallinealignment of materials thereacross during the solid phase epitaxycrystallization.

In an alternative aspect of the first embodiment, the magnetoresistivememory device may be switched by a voltage-controlled magneticanisotropy (“VCMA”) method rather than the STT method. In the VCMAconfiguration, the tunneling dielectric layer located between thereference layer 134 and the free layer 134 may be made thicker than thatin the STT configuration. In both the STT and VCMA configurations of themagnetoresistive memory device of the first embodiment, the increasedTMR improves the reading of the memory state of the device.

Referring to FIGS. 5A-5B, an exemplary voltage controlled exchangecoupling (VCEC) magnetoresistive memory device according to a secondembodiment of the present disclosure is illustrated. The VCECmagnetoresistive memory device may be written (i.e., programmed) by acombination of STT and VCEC effects and may be read using the TMReffect, as described in U.S. patent application Ser. No. 16/824,814,filed on Mar. 20, 1920, and incorporated herein by reference in itsentirety. The illustrated magnetoresistive memory device 180 of FIGS.5A-5B may be a magnetoresistive memory device 180 within the array ofmagnetoresistive memory devices 180 illustrated in FIG. 1. Each of themagnetoresistive memory devices 180 of FIGS. 5A-5B can be derived fromthe exemplary structure of FIGS. 4A and 4B by modifying the layer stackbetween the first electrically conductive line 30 and the secondelectrically conductive line 90.

Each of the magnetoresistive memory devices 180 of FIGS. 5A-5B includesa layer stack that includes at least, from one side to another, a firstelectrode 112, a perpendicular-magnetic-anisotropy (PMA) ferromagneticlayer 114, an electrically conductive, nonmagnetic interlayer exchangecoupling layer 132, a ferromagnetic free layer 144, a first tunnelingdielectric layer 231, a metallic quantum well layer (154, 254) which maybe ferromagnetic metallic quantum well layer 154 (which may function asan additional reference layer) or a nonmagnetic metallic quantum welllayer 254, a second tunneling dielectric layer 233, a ferromagneticreference layer 134, an optional SAF structure 260 and/or hardmagnetization layer, and a second electrode 170. In one embodiment, thefirst electrode 112 can be electrically connected to one of the firstelectrically conductive (e.g., word) lines 30, and the second electrode170 can be electrically connected to one of the second electricallyconductive (e.g., bit) lines 90. A metallic cap layer 172 may beoptionally formed between the second electrode 170 and a secondelectrically conductive line 90. Alternatively, the first electrode 112can be connected to one of the second electrically conductive lines 90,and the second electrode 170 can be connected to one of the firstelectrically conductive lines 30. The material stack including the PMAferromagnetic layer 114, the nonmagnetic interlayer exchange couplinglayer 132, and the free layer 144 constitutes a voltage controlledexchange coupling (VCEC) layer stack 140. The material stack includingthe free layer 144, the first tunneling dielectric layer 231, themetallic quantum well layer (154, 254), the second tunneling dielectriclayer 233, the reference layer 134, and the SAF structure 260 comprisesa magnetic tunnel junction 250.

The first electrode 112 can have the same material composition and thesame dimensions as the first electrode 112 of the magnetoresistivememory devices 180 of FIGS. 4A and 4B. Theperpendicular-magnetic-anisotropy (PMA) ferromagnetic layer 114 includesa material that can provide high perpendicular magnetic anisotropy.Thus, the magnetization direction of the PMA ferromagnetic layer 114 isalong a vertical direction, i.e., the direction that is perpendicular tothe interfaces between contacting layers within the hybridmagnetoresistive memory cell. The ferromagnetic material of the PMAferromagnetic layer 114 does not need to generate any spin-polarizedcurrent. Thus, any hard magnetic material that can provide highperpendicular magnetic anisotropy can be employed for the PMAferromagnetic layer 114.

In one embodiment, the PMA ferromagnetic layer 114 comprises a materialselected from a FePt alloy, a FePd alloy, a CoPt alloy, a Pt/Comultilayer stack, a Co/Ag multilayer stack, a Co/Cu multilayer stack, aCo/Ni multilayer stack, a (Pt/Co/Pt)/Pd multilayer stack, a(Pt/Co/Pt)/Ag multilayer stack, a (Pt/Co/Pt)/Cu multilayer stack, a(Pt/Co/Pt)/Ni multilayer stack, and a Co/(Pt/Pd) multilayer stack. In anillustrative example, the PMA ferromagnetic layer 114 can include L1₀alloys of FePt, FePd, or CoPt disclosed in Journal of Applied Physics111, 07A708 (2012). The FePt alloy, the FePd alloy, and the CoPt alloycan have a magnetic anisotropy constant of 6.6×10⁷ erg/cm³, 1.8×10⁷erg/cm³, and 4.9×10⁷ erg/cm³, respectively. In another illustrativeexample, the PMA ferromagnetic layer 114 can include Pt/Co multiplayers,Co/Ag multilayers, Co/Cu multilayers, or Co/Ni multilayers, or caninclude (Pt/Co/Pt)/Pd multilayers, (Pt/Co/Pt)/Ag multilayers,(Pt/Co/Pt)/Cu multilayers, or (Pt/Co/Pt)/Ni multilayers disclosed inIEEE Transaction on Magnetics 31, 3337 (1995). In yet anotherillustrative example, the PMA ferromagnetic layer 114 can includeCo/(Pt/Pd) multilayers or Co/(Pd/Pt) multilayers disclosed in Journal ofApplied Physics 77, 3995 (1995). The PMA ferromagnetic layer 114 canhave a fixed magnetization direction, which can be a vertical direction,i.e., an upward direction or a downward direction.

The nonmagnetic interlayer exchange coupling layer 132, includes anelectrically conductive, non-magnetic material that can provide avoltage-dependent exchange coupling between the PMA ferromagnetic layer114 and the free layer 144 such that energy levels of a parallel stateand an antiparallel state of the free layer 144 shift in oppositedirections upon application of a voltage between the electrode layers(112, 170) (e.g., upon application of a voltage between the firstelectrode 112 and the second electrode 170).

Suitable materials for the nonmagnetic interlayer exchange couplinglayer 132 include non-magnetic electrically conductive materials, suchas metallic materials (e.g., elemental metals and metal alloys), forexample, including but not restricted to, Au, Cu, Cr, and/or Al andtheir alloys. In one embodiment, the nonmagnetic interlayer exchangecoupling layer 132 can consist essentially of a metallic elementselected from Au, Cu, Cr, and Al. In one embodiment, the nonmagneticinterlayer exchange coupling layer 132 can have a thickness in a rangefrom one atomic layer (i.e., monolayer) of the metallic element to fivelayers of the metallic element, such as from two to four atomic layers.For example, the nonmagnetic interlayer exchange coupling layer 132 canhave a thickness of 0.1 to 7 nm, such as 0.3 to 5 nm.

The free layer 144 can have the same material composition and the samedimensions as the free layer 144 of the magnetoresistive memory devices180 of FIGS. 4A and 4B. The free layer 144 has a thickness that is thinenough to quantize the energy levels within the free layer 144. Forexample, the free layer 144 can have a thickness in a range from 0.3 nmto 2 nm, such as 0.5 nm to 1.2 nm, although greater thicknesses may alsobe employed. Thus, the free layer 144 has discrete energy states. Thefree layer 144 can have a parallel state in which the magnetizationdirection of the free layer 144 is parallel to the fixed magnetizationdirection of the PMA ferromagnetic layer 114, and an antiparallel statein which the magnetization direction of the free layer 144 isantiparallel to the fixed magnetization direction of the PMAferromagnetic layer 114.

The first tunneling dielectric layer 231 may have the same thicknessrange and the same material composition as the first tunnelingdielectric layer 131 of the magnetoresistive memory devices 180 of FIGS.4A and 4B.

The metallic quantum well layer (154, 254) may be a ferromagneticquantum well (e.g., additional reference) layer 154 or may be anonmagnetic metallic quantum well layer 254. In the embodiment shown inFIG. 5A, the metallic quantum well layer (154, 254) is a quantum wellferromagnetic reference layer 154, which may have the same thicknessrange and the same material composition as the reference layer 134 ofthe magnetoresistive memory devices 180 of FIGS. 4A and 4B. In anotherembodiment shown in FIG. 5B, the metallic quantum well layer (154, 254)is a nonmagnetic metallic quantum well layer 254 having a thickness thatis thin enough to quantize the energy levels therein. For example, thethickness of the nonmagnetic metallic quantum well layer 254 may be in arange from 0.3 nm to 2 nm, such as 0.5 nm to 1.2 nm, although a greaterthickness may be employed. The nonmagnetic metallic quantum well layer234 includes a metal, which can be, for example, Ta, Ti, V, Cr, Mn, Zr,Nb, Mo, Tc, Ru, Rh, Hf, W, Re, Os, Jr, and/or alloys thereof.

In one embodiment, the energy level of one of the parallel state and theantiparallel state of the free layer 144 can be within 0.1 eV from adiscrete energy level of the metallic quantum well layer (154, 254), andan energy level of another of the parallel state and the antiparallelstate of the free layer 144 is offset from each discrete energy level ofthe metallic quantum well layer (154, 254) by at least by 0.1 eV.

The second tunneling dielectric layer 233 may have the same thicknessrange and the same material composition as the second tunnelingdielectric layer 133 of the magnetoresistive memory devices 180 of FIGS.4A and 4B. The metallic quantum well layer (154, 254) is located betweenthe first and second tunneling dielectric layers (231, 233) whichfunction as energy barriers for the metallic quantum well layer (154,254).

The reference layer 134 may have the same thickness range and the samematerial composition as the reference layer 134 of the magnetoresistivememory devices 180 of FIGS. 4A and 4B.

The SAF structure 260 may be the same as the SAF structure 120 in themagnetoresistive memory device 180 of FIGS. 4A and 4B. The secondelectrode 170 and the metallic cap layer 172 may be the same as in themagnetoresistive memory device 180 of FIGS. 4A and 4B.

According to the second embodiment of the present disclosure illustratedin FIGS. 5A and 5B, a magnetoresistive memory device 180 comprises avoltage controlled exchange coupling layer stack 140 comprising aperpendicular magnetic anisotropy (PMA) ferromagnetic layer 114 having afixed magnetization direction, a ferromagnetic free layer 144, and anelectrically conductive nonmagnetic interlayer exchange coupling layer132 located between the free layer and the PMA ferromagnetic layer andproviding voltage dependent exchange coupling between the free layer andthe PMA ferromagnetic layer, a magnetic tunnel junction 250 comprising aferromagnetic reference layer 134, a first tunneling dielectric layer231, a second tunneling dielectric layer 233, and a metallic quantumwell layer (154, 254) located between the first and the second tunnelingdielectric layers, where the magnetic tunnel junction 250 also includesthe free layer 144, a first electrode 112 located on a first side of acombination of the voltage controlled exchange coupling layer stack andthe magnetic tunnel junction, and a second electrode 170 located on asecond side of the combination of the voltage controlled exchangecoupling layer stack and the magnetic tunnel junction.

In one embodiment, the free layer 144 has two stable magnetizationstates which comprise a parallel state having a parallel magnetizationdirection that is parallel to the fixed magnetization direction, and anantiparallel state having an antiparallel magnetization direction thatis antiparallel to the fixed magnetization direction. An energy level ofone of the parallel state and the antiparallel state of the free layeris within 0.1 eV from a discrete energy level of the metallic quantumwell layer, and an energy level of another of the parallel state and theantiparallel state of the free layer is offset from each discrete energylevel of the metallic quantum well layer by at least by 0.1 eV.

In one embodiment, the metallic quantum well layer comprises anonmagnetic metallic quantum well layer 254. In another embodiment, themetallic quantum well layer comprises a ferromagnetic quantum well layer154.

In one embodiment, each of the first and the second tunneling dielectriclayers comprises magnesium oxide or MgAl₂O₄. In one embodiment, themetallic quantum well layer (154, 254) has an average thickness in arange from 0.3 nm to 2 nm.

In one embodiment, energy levels of a parallel state and an antiparallelstate of the free layer shift in opposite directions upon application ofvoltages of different polarities between the first electrode and secondelectrode due to voltage-controlled exchange coupling with the PMAferromagnetic layer.

In one embodiment the PMA ferromagnetic layer 114 has greaterperpendicular magnetic anisotropy than the free layer 144. In oneembodiment, the nonmagnetic interlayer exchange coupling layer 132 hasan exchange coupling coefficient having a magnitude in a range from1×10⁻⁷ erg/(V·cm) to 4×10⁻⁶ erg/(V·cm) within a voltage range from −10 Vto 10 V. In one embodiment, the nonmagnetic interlayer exchange couplinglayer consists essentially of at least one metallic element selectedfrom Au, Cu, Cr or Al. In one embodiment, the PMA ferromagnetic layercomprises a material selected from a FePt alloy, a FePd alloy, a CoPtalloy, a Pt/Co multilayer stack, a Co/Ag multilayer stack, a Co/Cumultilayer stack, a Co/Ni multilayer stack, a (Pt/Co/Pt)/Pd multilayerstack, a (Pt/Co/Pt)/Ag multilayer stack, a (Pt/Co/Pt)/Cu multilayerstack, a (Pt/Co/Pt)/Ni multilayer stack, and a Co/(Pt/Pd) multilayerstack.

In one embodiment, the device further comprises a programming circuitry570 configured to apply a programming voltage selected from a positivevoltage pulse and a negative voltage pulse across the first electrodeand the second electrode to induce the free layer to transition into atarget magnetization state, and a sense circuitry 570 configured toapply a sense voltage pulse of a fixed polarity between the firstelectrode and the second electrode, wherein a magnitude of the sensevoltage pulse is less than a voltage magnitude required to switch themagnetization state of the free layer.

As shown in FIG. 1, a magnetoresistive random access memory 501comprises a two-dimensional array of instances of the magnetoresistivememory devices 180 (e.g., VCEC MRAM cells), word lines 30 electricallyconnecting a respective subset of the first electrodes of thetwo-dimensional array, bit lines 90 electrically connecting a respectivesubset of the second electrodes of the two-dimensional array; and aprogramming and sensing circuitry 570 connected to the bit lines 90.

A method of operating the magnetoresistive memory device 180 comprisesapplying a first polarity programming voltage to the first electroderelative to the second electrode in a first programming step to switch amagnetization of the free layer from a parallel state to an antiparallelstate with respect to the fixed magnetization direction, applying asecond polarity programming voltage having a polarity that is oppositeto the first polarity voltage to the first electrode relative to thesecond electrode in a second programming step to switch themagnetization of the free layer from the antiparallel state to theparallel state with respect to the fixed magnetization direction, andapplying a sense voltage pulse of a fixed polarity between the firstelectrode and the second electrode, wherein a magnitude of the sensevoltage pulse is less than a voltage magnitude required to switch themagnetization of the free layer.

FIGS. 6A-6C illustrate vertical cross-sectional view of variousconfigurations of an exemplary magnetoresistive memory device 280according to a third embodiment of the present disclosure. FIG. 6D is aperspective view of the exemplary spin-orbit-torque magnetoresistivememory device 280 of an embodiment of the present disclosure. Theexemplary magnetoresistive memory device 280 can be a spin-orbit-torque(SOT) magnetoresistive memory device 280. The SOT magnetoresistivememory device 280 can include a magnetic tunnel junction comprising thefree layer 144, a first tunneling dielectric layer 231, a metallicquantum well layer that comprises an additional ferromagnetic referencelayer 154 or a nonmagnetic metallic quantum well layer 254, a secondtunneling dielectric layer 233, a ferromagnetic reference layer 134, afirst electrode 270, and a spin Hall effect metal line 330 contacting asurface of the free layer 144 and extending along a direction that isparallel to the surface of the free layer 144. Respective first andsecond electrical contacts (332, 333) electrically contact respectivefirst and second end of the spin Hall effect metal line 330. Theelectrical contacts (332, 333) can be configured for flowing aprogramming electrical current therethrough. For example, the electricalcontacts (332, 333) can be connected to output nodes of a programmingcircuit. The spin Hall effect metal line 330 can comprise a firstelectrically conductive line. The first electrode 270 can beelectrically connected to a second electrically conductive line 390which is connected to an output node of a sensing (i.e., reading)circuit. The reading current flows through the second electricallyconductive line 390. The reading current flows through the SOTmagnetoresistive memory device 280 between the second electricallyconductive line 390 and one of the electrical contacts (332, 333). A SAFstructure 260 or a hard magnetization layer can be optionally providedbetween the first electrode 270 and the reference layer 134. A metalliccap layer 272 can be optionally provided between the first electrode 270and the second electrically conductive line 390.

The spin Hall effect metal line 330 can be formed on a lower-leveldielectric layer 110. Generally, the spin Hall effect metal line 330 isconfigured to provide torque to the free layer 144 to assist switchingof the magnetization direction of the respective free layer 144 duringprogramming. The spin Hall effect metal lines 330 can comprise, and/orconsist essentially of, at least one heavy elemental metal to maximizespin transfer across the interface between the free layer 144 and thespin Hall effect metal lines 330. In one embodiment, the elemental metalcan have an atomic number in a range from, and including, 72 to, andincluding, 79. For example, the at least one elemental metal can includeone or more of Hf, Ta, W, Re, Os, Ir, Pt, or Au. In one embodiment, thespin Hall effect metal lines 330 can comprise, and/or consistessentially of, beta phase tungsten, beta phase tantalum or platinum. Inother words, in an embodiment, the spin Hall effect metal line 330 ismade of an elemental metal which is undoped and unalloyed other thanunavoidable impurities that are introduced during manufacturing at tracelevels. In one embodiment, the spin Hall effect metal line 330 contactsa horizontal surface of the free layer.

The free layer 144 can have the same material composition and the samethickness range as in the previously described embodiments. The freelayer 144 can have a parallel state in which the magnetization directionof the free layer 144 is parallel to the fixed magnetization directionof the reference layer 134, and an antiparallel state in which themagnetization direction of the free layer 144 is antiparallel to thefixed magnetization direction of the reference layer 134.

The first and second tunneling dielectric layers (231, 233) may have thesame thickness range and the same material composition as the first andsecond tunneling dielectric layers (231, 233) of the magnetoresistivememory devices 180 of FIGS. 5A-5B.

The metallic quantum well layer (154 or 254) has a thickness that isthin enough to quantize the energy levels within the layer. For example,this layer can have a thickness in a range from 0.5 nm to 2 nm, such as0.8 to 1.2 nm although greater thicknesses may also be employed. Thus,the metallic quantum well layer has discrete energy states.

In one embodiment shown in FIG. 6A, the SOT magnetoresistive memorydevice 280 includes two ferromagnetic reference layers (134, 154). Thefirst reference layer 134 is located between the SAF structure 260 andthe second tunneling dielectric layer 233. The second reference layer154 comprises the metallic quantum well layer located between the twotunneling dielectric layers (231, 233).

In another embodiment shown in FIG. 6B, at least one additionaltunneling dielectric layer 235 may be formed. The SOT magnetoresistivememory device 280 includes two ferromagnetic reference layers (134, 154)and three tunneling dielectric layers (231, 233, 235) which aredescribed above with respect to FIGS. 4A and 4B. In this embodiment,both the first and the second reference layers (134, 154) comprisemetallic quantum well layers which are located between respectivetunneling dielectric layers.

In yet another embodiment shown in FIG. 6C, the second reference layer154 of FIG. 6B is replaced with a nonmagnetic metallic quantum welllayer 254. Each additional nonmagnetic metallic quantum well layer 254may have the same thickness range and the same material composition asany of the nonmagnetic metallic quantum well layer 254 described above.

The first electrode 270 may have the same material composition and thesame thickness range as the second electrode 170 of FIGS. 4A, 4B, and5A-5B. The metallic cap layer 272 may have the same material compositionand the same thickness as the metallic cap layer 172 of FIGS. 4A, 4B,and 5A-5B.

The illustrated magnetoresistive memory device 280 of FIGS. 6A-6D may beemployed as a magnetoresistive memory device 280 within the array ofmagnetoresistive memory devices 180 illustrated in FIG. 7. FIG. 7illustrates a magnetoresistive random access memory (MRAM) device 600including a two-dimensional array of magnetoresistive memory devices280, which may be derived from the MRAM device 501 of FIG. 1 by alteringaddressing schematics from the two terminal magnetoresistive memorydevices 180 to the three terminal SOT magnetoresistive memory devices280. The random access memory device 600 may comprise an MRAM device.The device 600 includes a memory array region 550 containing an array ofrespective magnetic devices, such as magnetic tunnel junction devices(e.g., SOT magnetoresistive memory cells) 280 located at intersectionsfirst access lines (which may comprise first electrically conductivelines 330 as illustrated or as second electrically conductive lines 390in an alternate configuration) and second access lines (which maycomprise second electrically conductive lines 390 as illustrated or asfirst electrically conductive lines 330 in an alternate configuration).Each first access line 330 may be a spin Hall effect metal line 330described above. Each second electrically conductive line 390 can beelectrically connected to a first electrode 270 of a respective magnetictunnel junction device 280. Each first access line (i.e., each spin Halleffect metal line 330) may have a first electrical contact 332electrically connected to one of the array decoder and programmingcircuit 660 or the power supply 620, and a second electrical contact 333electrically connected to the other of the array decoder and programmingcircuit 660 and the power supply 620. Thus, electrical current througheach spin Hall effect metal line 330 can be individually controlled.

The random access memory device 600 may also contain a sensing circuit670 (which may include sense amplifiers and control circuits) connectedto the second access lines, i.e., the second electrically conductivelines 390. A column decoder 580 and a data buffer 590 may be connectedto the sense circuitry. The magnetoresistive memory devices 280 areprovided in an array configuration that forms the random access memorydevice 600. In one embodiment, the magnetoresistive memory devices 280may be provided as a rectangular array. It should be noted that thelocation and interconnection of elements are schematic, and the elementsmay be arranged in a different configuration. Further, amagnetoresistive memory device 280 may be manufactured as a discretedevice, i.e., a single isolated device.

The random access configuration illustrated in the random access memorydevice 600 is only exemplary, and the magnetoresistive memory devices280 of the embodiments of the present disclosure can be connected indifferent interconnection configurations.

According to the third embodiment of the present disclosure illustratedin FIGS. 6A-6D, a spin-orbit-torque (SOT) magnetoresistive memory device280 comprises a magnetic tunnel junction comprising, from one side toanother, a ferromagnetic free layer 144, a first tunneling dielectriclayer 231, a metallic quantum well layer (154, 254), a second tunnelingdielectric layer 233, and ferromagnetic reference layer 134. A firstelectrode 270 is located on the reference layer 134 side the magnetictunnel junction. A spin Hall effect metal line 330 contacts a surface ofthe free layer 144, a first electrical contact 332 electrically contactsa first end of the spin Hall effect metal line 330, and a secondelectrical contact 333 electrically contacts a second end of the spinHall effect metal line 330.

In one embodiment, the device 600 can comprise a programming circuit 660configured to flow a programming current through the spin Hall effectmetal line 330 between electrical contacts 332 and 333 and sensingcircuit 670 configured to flow a measurement current through the device280. In one embodiment, the energy levels of the various material layerscan have the configuration illustrated in FIGS. 2A and 2B.

In the embodiments illustrated in FIGS. 6A and 6B, the metallic quantumwell layer comprises an additional ferromagnetic reference layer 154. Inanother embodiment illustrated in FIG. 6C, the metallic quantum welllayer comprises a nonmagnetic metal layer 254.

In one embodiment, each of the first tunneling dielectric layer 231 andthe second tunneling dielectric layer 233 is thicker than the metallicquantum well layer (154, 254).

In one embodiment, the free layer 144 has two stable magnetizationstates which comprise a parallel state having a parallel magnetizationdirection that is parallel to a fixed magnetization direction of thereference layer 134, and an antiparallel state having an antiparallelmagnetization direction that is antiparallel to the fixed magnetizationdirection of the reference layer 134, an energy level of one of theparallel state and the antiparallel state of the free layer 144 iswithin 0.1 eV of a discrete energy level of the metallic quantum welllayer (154, 254), and an energy level of an additional one of theparallel state and the antiparallel state of the free layer 144 isoffset from each discrete energy level of the metallic quantum welllayer (154, 254) at least by 0.1 eV.

In the embodiment of FIG. 6B, the reference layer 134 comprises anadditional metallic quantum well layer, and the device 280 comprises andan additional tunneling dielectric layer 235 located between the secondtunneling dielectric layer 233 and the first electrode 270. wherein adiscrete energy level within the additional metallic quantum well layeris within 0.1 eV of the discrete energy level of the metallic quantumwell layer.

In one embodiment, a synthetic antiferromagnetic structure 260 islocated between the first electrode 270 and the reference layer 134. Inone embodiment, the metallic quantum well layer (154, 254) has anaverage thickness in a range from 0.3 nm to 2 nm.

In one embodiment, the free layer 144 comprises a respectiveferromagnetic material in which a total atomic percentage of Fe, Co, Ni,and B is at least 80%. In another embodiment, the free layer 144comprises a Heusler alloy. In one embodiment, each of the firsttunneling dielectric layer 231 and the second tunneling dielectric layer233 comprises magnesium oxide. In another embodiment, at least one ofthe first tunneling dielectric layer 231 and the second tunneling 233dielectric layer comprises MgAl₂O₄. In one embodiment, the spin Halleffect metal line 330 comprises Hf, Ta, W, Re, Os, Ir, Pt, or Au.

In the embodiment illustrated in FIG. 7, a spin-obit-torque (SOT)magnetoresistive random access memory (MRAM) device 600 comprises atwo-dimensional array of instances of the SOT magnetoresistive memorydevice 280, first access lines comprising a respective instance of thespin Hall effect metal lines 330 of the two-dimensional array, andsecond access lines 390 electrically connecting a respective subset ofthe first electrodes 270 of the two-dimensional array.

A method of operating the SOT magnetoresistive memory device 280comprises applying a programming current between the first and thesecond electrical contacts (332, 333), and a reading (i.e., sensing)current between the first electrode 270 and one of the first or thesecond electrical contacts (332, 333).

Although the foregoing refers to particular preferred embodiments, itwill be understood that the disclosure is not so limited. It will occurto those of ordinary skill in the art that various modifications may bemade to the disclosed embodiments and that such modifications areintended to be within the scope of the disclosure. Where an embodimentemploying a particular structure and/or configuration is illustrated inthe present disclosure, it is understood that the present disclosure maybe practiced with any other compatible structures and/or configurationsthat are functionally equivalent provided that such substitutions arenot explicitly forbidden or otherwise known to be impossible to one ofordinary skill in the art. All of the publications, patent applicationsand patents cited herein are incorporated herein by reference in theirentirety.

What is claimed is:
 1. A method of forming a magnetoresistive memorydevice, comprising: forming a first electrode over a substrate;depositing a magnetic tunnel junction layer stack over the firstelectrode, wherein the magnetic tunnel junction layer stack comprises,from one side to another, a first texture-breaking nonmagnetic layerincluding a first nonmagnetic transition metal, a magnesium oxide firsttunneling dielectric layer including grains having (001) texture, areference layer including a first amorphous ferromagnetic material, aspinel second dielectric tunneling layer including an amorphous spinelmaterial, a free layer including a second amorphous ferromagneticmaterial, a magnesium oxide third tunneling dielectric layer includinggrains having (001) texture, and a second texture-breaking nonmagneticlayer including a second nonmagnetic transition metal; performing ananneal process to induce solid phase epitaxy crystallization ofmaterials of the free layer, the second tunneling dielectric layer, andthe reference layer using at least one of the first or the thirdtunneling dielectric layer as a crystallization template layer, toconvert the amorphous spinel material of the second tunneling dielectriclayer into polycrystalline spinel material having (001) texture along anaxial direction that is perpendicular to an interface between the secondtunneling dielectric layer and the free layer; and forming a secondelectrode over a portion of the magnetic tunnel junction layer stackprior to or after the anneal process.
 2. The method of claim 1, whereinthe solid phase epitaxy converts each of the reference layer and thefree layer into polycrystalline iron or Heusler alloy ferromagneticmaterial layers having (001) texture.
 3. The method of claim 2, whereinthe spinel material comprises Mg—Al—O_(x) or MgAl₂O₄.
 4. The method ofclaim 1, wherein each of the first texture-breaking nonmagnetic layerand the second texture-breaking nonmagnetic layer blocks propagation ofcrystalline alignment of materials thereacross during the solid phaseepitaxy crystallization.